Application
Electrical insulation
Insulation and passivation, thin enough for a device
The situation
Films that have to insulate, passivate or keep moisture away from a circuit or a device: coatings on busbars, coil windings, connectors, sensors and passivation on semiconductor surfaces.
What fails today
- A film that insulates at 1 µm leaks once the surface roughens.
- Passivation layers applied over a contaminated surface trap ions and shift the device.
- Cure schedules that leave unreacted material lower the resistivity over time.
- Thin films on sharp edges break down at the edge, not in the middle.
How to apply it
Film thickness is the variable that decides the result; specify it and measure it.
Cure fully. Residual reactivity in a sealed device is a long-term risk, not a short-term one.
Edges, vias and sharp transitions need a thicker deposit than a flat surface.
The dielectric data on this site is being measured; ask the technical contact for the current figures before you design to them.
How to qualify it
- Dielectric strength to ASTM D149 or IEC 60243-1, reported with the film thickness: the breakdown voltage alone says nothing.
- Volume resistivity to IEC 62631 (GB/T 35856) after conditioning at a stated humidity.
- A moisture-barrier test on the real device, not on a free film.
- Adhesion and thermal cycling, because an insulating film that lifts at a solder reflow has failed electrically.
Bring your substrate and your target; we quote a grade and a cure schedule against it.
Next step